BANGALORE, India –
Tessolve (www.tessolve.com), the leading provider of engineered solutions to the semiconductor industry, announces the acquisition of Pico2Femto Semiconductor (P2fsemi), a company primarily focused on physical design solutions.
With the acquisition of P2fsemi, Tessolve’s ASIC design offering – from RTL to GDSII signoff – is significantly strengthened with backend design expertise for turnkey solutions. Tessolve has pioneered a range of turnkey solutions from design to testing of packaged parts over the past few years, becoming the largest independent provider of engineered semiconductor solutions.
With more than 100 physical design professionals, P2fsemi helps customers achieve immediate silicon success with technology nodes as small as 3nm. His skills include healing complex high-speed IPs and complex low-power SOCs from top-level implementation to sign-off. P2fsemi will complement and deepen Tessolve’s existing pre-silicon design solutions.
Balaji Prabhakar, CEO of P2fsemi, said: “Both companies share a common philosophy and this merger brings significant opportunities for all stakeholders, customers and employees. As part of Tessolve, we will be able to provide the best technical solutions to our new and expanded global customer base, deliver greater value to existing customers and create a better educated technical talent pool in the region.”
“With outstanding physical design expertise in advanced process nodes, the P2fsemi team is a great addition to our strong technical staff delivering cutting-edge silicon design solutions. Towards our goal of becoming the leading platform company for silicon and system design and product implementation, additional key investments in our program to be a value-adding technical partner to our customers. I am delighted to welcome Balaji Prabhakar’s team to the Tessolve family,” said Srini Chinamilli, CEO of Tessolve.
Thanks to its recent growth and new acquisitions, Tessolve has quickly established itself as a key partner for silicon design services. With people at the heart of its core values, Tessolve continues to help its customers succeed while empowering employees to push the boundaries of technology.
Tessolve (a Hero Electronix Venture) is the leading provider of technical services and solutions with more than 3000 employees worldwide and an extensive range of pre- and post-silicon expertise. Tessolve offers a one-stop-shop solution with mature hardware and software capabilities, including its advanced silicon and system test laboratories.
Tessolve offers complete turnkey ASIC solutions from design to packaged parts. We actively invest in R&D excellence center initiatives, such as 5G, mmWave, high power PMICs, HSIO, HBM/3D/Chiplets, system level testing, advanced test methods and others.
Tessolve also provides end-to-end embedded product design services from concept to manufacturing under an ODM model with application expertise in avionics, automotive, data center/enterprise, industrial/IoT and wireless segments. Visit www.tessolve.com for more information.
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Source: Business Wire